Thermal Liquid, Gel & Putty Gap Filler

Thermal liquid & Gel AB double component systems are a soft silicone-based thermally conductive gap-filling material with high thermal conductivity, low interfacial thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the heat sink/housing, etc., making them in close contact, reducing thermal resistance, and quickly and effectively reducing the temperature of the electronic components, thereby extending the life of the electronic components and improving their reliability. The Therma Liquid & Gel AB can be applied by hand or by dispensing equipment.